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ASM Sets Up Research Center In Chengdu

Aggregated Source: ChinaTechNews.com
June 13, 2008|

ASM Pacific Technology Limited, a Hong Kong listed semiconductor packaging giant, has signed a cooperation agreement with Chengdu High-tech Zone to invest USD30 million in setting up a semiconductor equipment research and development center in Chengdu. According to the agreement, ASM will inject more than USD30 million in the first schedule to establish a semiconductor packaging [...]

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